Spot Heat Wirebonding

ABSTRACT

Methods and systems are disclosed for forming secure wirebonds between electrical contacts in electronic device assemblies. Representative embodiments of the invention are described for forming a wirebond including system components and method steps for generating electromagnetic energy from a heat source and transmitting heat to a ball formed on a bondwire. Subsequently, pressure applied to the ball at the bonding site is used in the formation of a wirebond.

This is a continuation of application Ser. No. 11/120,773 filed May 3,2005, the contents of which are incorporated by reference in itsentirety.

TECHNICAL FIELD

The invention relates to the manufacture of semiconductor devices. Moreparticularly, the invention relates to methods and systems for formingwirebonds useful for assembling semiconductor devices.

BACKGROUND OF THE INVENTION

In order to facilitate electrical connections among semiconductor deviceterminals and external leads, wirebonds are formed by coupling abondwire to a bonding site. Generally a bondwire is positioned at abonding site, such as a bond pad on a chip or PCB, while various forcesare applied to cause the metals of the wire and bond pad to fuse. Thebondwire is usually made of gold, although bondwires of other metalssuch as aluminum or copper are also used in the semiconductormanufacturing industry. Ball bonding is a common wirebond process. Forthe purpose of providing context and example, gold ball bonding isdiscussed herein, although the invention may also be practiced with ballbonding using other materials. During gold ball bonding, a generallyspherical or other shape gold nodule, frequently called a “ball” isformed by melting the end of a gold bondwire held by a part of a bondingtool known as a capillary. Capillaries known in the art are typicallyceramic axially symmetrical tools with vertical feedholes for feedingthe bondwire through the center. Capillaries commonly hold and controlthe bondwire during the bonding process and are used to exert pressureand transmit ultrasonic energy to the bonding location.

The ball is brought into contact with the bond pad. A controlled amountof pressure is then applied by the capillary for a selected amount oftime, contributing to the formation of a metallurgical weld between thebondwire and the bond pad as well as deforming the ball into its finalshape. The application of pressure interacts with the application ofultrasonic energy as further discussed below. The wirebonding toolsevers the wire in preparation for the next wirebond by clamping thewire and raising the capillary. Problems are sometimes encountered inthe application of pressure to form the bond. If the pressure isinsufficient, a poor bond can result. Excessive pressure can result indamage to associated circuitry.

Wirebonding requires that the bondwire and bond pad be placed inintimate contact with each other. Better bonds are achieved when contactis enhanced using ultrasonic energy. The ultrasonic energy is applied asthe ball at the end of the bondwire is brought into contact with thebond pad by the capillary, exerting pressure to push the ball againstthe bond pad. The ultrasonic energy applied by the bonding tool abradesthe ball of the bondwire against the surface of the bond pad. Thisabrading action cleans the bond pad of debris and oxides that may bepresent, exposing a fresh surface of the bond pad useful for forming asecure bond. The continued application of ultrasonic energy also resultsin mutual deformation of the bondwire and bond pad where they abradeagainst one another, which can enhance the metallurgical bond. Theamount of ultrasonic energy applied must be carefully controlled.Excessive ultrasonic energy can stress the nascent bond, and theapplication of insufficient ultrasonic energy fails to adequatelyenhance bonding. The application of insufficient pressure can alsoinhibit the effective transmission of ultrasonic energy.

When the bondwire and bond pad are made from different metals, such asin the case of wirebonding gold wire to an aluminum bond pad, forexample, thermal energy is used to enhance bonding. In effect, heat isused to soften the harder metal, in this example aluminum, to match thehardness of the softer metal, in this example gold. In order to reachthe required temperature, heat is applied to the bond pad by heating theunderlying surface, such as a PCB. Insufficient heat can inhibitbonding, while excessive heat can result in damage to the circuitry.Some configurations, such as overhangs or stacked die assemblies presentparticular problems in directing an acceptable amount of heat to thebonding site.

Due to these and other problems, it is desirable to avoid unnecessaryheating of devices during wirebonding, to efficiently direct thermalenergy to desired locations, and to avoid excessive ultrasonicvibrations. Improved wirebonding techniques and systems adapted toprovide one or more of these or similar benefits would be useful andadvantageous in the arts.

SUMMARY OF THE INVENTION

In carrying out the principles of the present invention, in accordancewith preferred embodiments thereof, preferred embodiments of theinvention provide methods and systems for forming secure wirebondsbetween electrical contacts in semiconductor device assemblies. A methodof wirebonding according to the invention includes steps for positioninga bondwire and ball adjacent to a bonding site with a bonding tool,heating the bondwire, ball, and bonding tool, and then placing the ballin contact with the bonding site.

According to an aspect of the invention, a preferred embodiment of amethod of forming a wirebond includes steps for applying electromagneticenergy to heat a ball formed on a bondwire and subsequently applyingpressure to the ball at the bonding site.

According to other aspects of the invention, in examples of preferredembodiments, reflected heat is directed to the bondwire, ball, andbonding tool to facilitate bonding.

According to yet another aspect of the invention, a system forwirebonding for use in assembling semiconductor devices includes abonding tool for positioning a bondwire and ball adjacent to a bondingsite and for placing the bondwire and ball in contact with the bondingsite. A heat source is operably coupled to a heat conduit for heatingthe bondwire, ball, and bonding tool prior to the formation of a bond.

According to yet another aspect of the invention, a wirebonding systemincludes a heat reflector for reflecting heat to the bondwire from aheat source.

According to further aspects of the invention, preferred embodiments ofwirebonding systems are disclosed in which a concave heat reflector,such as a mirror, is used to direct heat to bond components.

The invention has advantages including but not limited to improvedwirebonding methods and systems that efficiently provide heat whererequired and reduce unwanted heat transfer. Further advantages arerealized in the potential reduction of ultrasonic energy and pressure.These and other features, advantages, and benefits of the presentinvention can be understood by one of ordinary skill in the arts uponcareful consideration of the detailed description of representativeembodiments of the invention in connection with the accompanyingdrawings.

BRIEF DESCRIPTION OF THE DRAWINGS

The present invention will be more clearly understood from considerationof the following detailed description and drawings in which:

FIG. 1A is a partial side view representing an example of preferredembodiments of systems and method steps for wirebonding according to theinvention;

FIG. 1B is a partial side view representing an example of preferredembodiments of systems and further method steps for wirebondingaccording to the invention;

FIG. 2A is a partial side view representing another example ofalternative preferred embodiments of systems and method steps forwirebonding according to the invention;

FIG. 2B is a partial side view representing further method steps forwirebonding according to the invention in the example of alternativeembodiments.

References in the detailed description correspond to like references inthe various drawings unless otherwise noted. Descriptive and directionalterms used in the written description such as first, second, top,bottom, upper, side, etc., refer to the drawings themselves as laid outon the paper and not to physical limitations of the invention unlessspecifically noted. The drawings are not to scale, and some features ofembodiments shown and discussed are simplified or amplified forillustrating the principles, features, and advantages of the invention.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS

In general, the invention provides improved wirebonding for themanufacture of integrated circuitry. The preferred embodiments ofmethods and systems of the invention shown and described by way ofexample may be used to provide secure wirebonds between electricalcontacts of a chip and substrate or leadframe and are particularlyuseful for forming wirebonds on stress-sensitive or heat-sensitiveassemblies, or to bonding sites to which heat does not transmit easily.

Referring primarily to FIG. 1A, a representative embodiment of systemsand methods 10 of wirebonding according to the invention is depicted. APCB 12 has a number of bonding sites 14 for receiving wires 16 for thepurpose of making external electrical connections. An unattached wire 18is shown held by a capillary 20. The capillary 20 is a tool known in thearts and is a portion of a larger tool used for forming wirebonds.Various equipment may be used for manipulating the unattached wire 18and PCB 12 within the scope of the invention. The bondwire 18 has a ball22, which is positioned adjacent to the bonding site 14 with the bondingtool 20 as known in the arts. A selected area including the ball 22 andpreferably the tip 24 of the capillary 20 is heated to create a heatedarea 26 preliminary to bringing the ball 22 into contact with thebonding site 14. As shown, a heat source 28, in this example anelectromagnetic heat bulb, is used to produce heat 29 for transmissionby a heat conduit 30, for example a fiber optic cable, to the heatedarea 26. The heat conduit 30 preferably has a lens 31 for focusing thetransmitted heat 29 on the selected area 26. A heat reflector 32 ispositioned to reflect transmitted heat 33 that initially escapes theheated area 26 back into the heated area 26. As shown in the preferredembodiment 10 of FIGS. 1A and 1B, the heat reflector 32 may be concave.In the presently preferred embodiment, a concave mirror 32 is used,although a flat mirror, or other concave or flat panel of reflectivematerial may also be used.

A contact heat source 35 may also be used to apply heat indirectly tothe bonding site 14 as is common in the arts, typically placed incontact with the PCB 12. As shown in FIG. 1B, The previously heated ball22 is pressed into contact with the bonding site 14, using the bondingtool 20 to apply a predetermined amount of compressing force 36. Apredetermined amount of ultrasonic energy 38 is also applied to the ball22 and bonding site 14 as is known in the art for forming wirebonds. Theball 22 deforms under the pressure of the compressing force 36 producingthe final shape of the completed wirebond 44.

It should be appreciated by those skilled in the arts that using theinvention, the compressing force 36 used to press on the ball 22, and/orthe ultrasonic energy 38 applied to the bonding site 14 and ball 22, mayin some instances be reduced from the amount otherwise required.Additionally or alternatively, the duration of the application of thecompressing force 36, or ultrasonic energy 38, or both, may be reducedbelow levels previously known in the arts in some applications withoutdetriment to producing a secure wirebond 44. It should also beunderstood that heat is applied precisely where needed to promotebonding without making physical contact with the device 46 undergoingassembly.

An alternative depiction of methods and systems 10 for wirebonding inthe assembly of semiconductor devices is shown in FIGS. 2A and 2B. Thebonding tool 20 is used for positioning a bondwire 18 and ball 22adjacent to a bonding site 14 and for subsequently placing the ball 22in contact with the bonding site 14. The ball 22 portion of the bondwire18 and the tip 24 of the bonding tool 20 are preheated as described by aheat source 28, conduit 30, and reflector 32. Additional heat may beprovided by an indirect heat source 35 in contact with the PCB 12. Asshown, the semiconductor device 46 may have one or more stacked PCBs12.Also, one or more of the PCBs 12 may have an overhanging portion 48. Ithas been found that overhangs 48 may in some instances be lesssusceptible to heat transmission from an indirect heat source 35, andthat overhangs may also be more likely to be damaged by relatively largeamounts of ultrasonic energy 38 or compression force 36. The use of theinvention as shown and described permits advantageous reductions in theexposure of such overhangs to potential damage.

The methods and systems of the invention provide advantages includingbut not limited to improved wirebonding in IC packages, avoidingtransfer of misplaced or excessive heat to nearby structures, andpermitting a reduction in ultrasonic energy required for forming asecure wirebond. While the invention has been described with referenceto certain illustrative embodiments, those described herein are notintended to be construed in a limiting sense. Various modifications andcombinations of the illustrative embodiments as well as other advantagesand embodiments of the invention will be apparent to persons skilled inthe arts upon reference to the drawings, description, and claims.

1. A method of wirebonding for use in assembling electronic devicescomprising the steps of: positioning a ball at an end of a bondwireadjacent to but not in contact with a bonding site with a bonding tool;transmitting electromagnetic energy for heating the bondwire, ball, andbonding tool; and placing the heated ball in contact with the bondingsite using the bonding tool, forming a ballbond on the bonding site. 2.A method according to claim 1 further comprising the step of applyingultrasonic energy to the ball and bonding site.
 3. A method according toclaim 1 further comprising the step of applying a compressing force tothe ball at the bonding site.
 4. A method according to claim 1 furthercomprising the step of applying indirect heat to the bonding site.
 5. Amethod according to claim 1 further comprising the step of applyingreflected heat to the ball.
 6. A method according to claim 1 furthercomprising the step of applying reflected heat to the bondwire.
 7. Amethod according to claim 1 further comprising the step of applyingreflected heat to the bonding tool.
 8. A method according to claim 1further comprising the step of applying reflected heat to the bondingsite.